KennTherm 9231 Thermal Compound is a non-silicone grease with low thermal impedance and long-term stability., the Specially formulated thermal compound with low viscosity and good consistency can be spread easily and evenly.
It can apply to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.
Features
- Non-Silicone Based
- No-metal compound
- No migration
- Safe to use
- Low dry-out
- Low thermal impedance
- Easy to apply
- Easy to clean-up
Specification
Properties
Test Methods
Units
Typical value
Color
White
Consistency
ASTM D217
400
Specific Gravity
ASTM D1475
g/cm3
2.5
Viscosity
BrookField CVE #7 @12RPM
Cps
170000
Thermal Properties
Thermal Conductivity
ASTM D5470
W/m-K
1.25
Thermal Impedance
ASTM D 5470
K-in2/W
0.036
Dry Out Test
240 hours at 363K
Weight%
<0.01
Electrical Properties
Dielectric constant
298K@1000 Hz
ASTM D-150
0.90
298K@100K Hz
ASTM D-150
0.60
Dissipation factor
298K@1000 Hz
ASTM D-150
0.23
298K@100K Hz
ASTM D-150
0.26
Dielectric Strength
ASTM D-149
kV/mm
4.8
Contact our Thermal Paste Consultant in area Malaysia (Selangor(Klang, Shah Alam, Subang), Kuala Lumpur(Sungai Buloh), Sepang, Negeri Sembilan, Melaka, Johor(Johor Bharu,Muar,Batu Pahat), Pahang(Temerloh, Kuantan), Kelantan, Terengganu, Perak(Ipoh), Kedah, Perlis, Penang, Sabah, Sarawak), Indonesia, Singapore, Thailand, Philippines, Vietnam, Laos, Myanmar, Cambodia, Brunei at sales@davor.com.my.